Three dimensional electronic patch

ABSTRACT

A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

BACKGROUND OF THE INVENTION

The present application relates to electronic devices, and inparticular, to electronic patches that can adhere to human skin or thesurface of an object.

Electronic patches or stickers can be attached to human bodies and otherobjects such as merchandized goods such as computers, machineries, andclothes, packaging material and shipping boxes. Electronic patches cancommunicate with smart phones or other devices wirelessly, through NFC,Bluetooth, WiFi, or other methods. Tags wearable by people are aspecific type of electronic patches.

Electronic patches can be used for tracking objects and for performingfunctions such as producing sound, light or vibrations, and so on. Asthe applications and human needs become more sophisticated and complex,there are a rapidly increasing number of tasks that electronic patchesare required to perform. Electronic patches are often required to beconformal to curved surfaces. In addition, the curvature of the humanskin can vary overtime.

Electronic patches and wearable tags can communicate with smart phonesand other devices using WiFi, Bluetooth, Near Field Communication (NFC),and other wireless technologies. NFC is a wireless communicationstandard that enables two devices to quickly establish communicationwithin a short range around radio frequency of 13.56 MHz. NFC is moresecure than other wireless technologies such as Bluetooth and Wi-Fibecause NFC requires two devices in close proximity (e.g. less than 10cm). NFC can also lower cost comparing to other wireless technologies byallowing one of the two devices to be passive (a passive NFC tag).

Bluetooth is another wireless technology standard for exchanging dataover relatively longer distances (in tens of meters). It employs shortwavelength UHF radio waves from 2.4 to 2.485 GHz from fixed or mobiledevices. Bluetooth devices have evolved to meet the increasing demandfor low-power solutions that is required for wearable electronics.Benefited from relatively longer reading distance and activecommunication, Bluetooth technologies allow wearable patches tocontinuously monitoring vital information without human interference,which is an advantage over NFC in many applications.

Wearable patch (or tag) is an electronic patch to be worn by a user. Awearable patch is required to stay on user's skin and operate for anextended period of time from hours to months. A wearable patch cancontain a micro-electronic system that can be accessed using NFC,Bluetooth, WiFi, or other wireless technologies. An authenticationwearable tag can be used as a “password” similar to a barcode. Forexample, it can recognize a user's smart phone for authenticationpurpose. A wearable patch can also be integrated with different sensorssuch as vital signs monitoring, motion track, skin temperaturemeasurements, and ECG detection.

Despite recent development efforts, conventional wearable devices stillface several drawbacks: they may not provide adequate comfort for usersto wear them; they may not stay attached to user's body for the requiredlength of time; they are usually not aesthetically appealing.

A wearable patch often includes multiple rigid semiconductor chips andsensors have significant thicknesses assembled on flexible printedcircuits to provide sensor, computation, and communication functions.The printed circuits are typically made of flexible polymer substratesthat are not deformable enough to adapt to commonly occurring shapechange, the high percentage of deformations of the user's skin, which isone reason for users' discomfort when they wear these wearable patches.

Another drawback of conventional wearable patches is that the rigidpolymer substrate is not very breathable. The build-up of sweat andmoisture can cause discomfort and irritation to the skin, especiallyafter wearing it for an extended period of time.

Moreover, conventional wearable patches are often not robust enough tosustain repeated elongations during body movements. Under stress,different layers in wearable patches can break or delaminate renderingthe wearable patches inoperable.

Another challenge for wearable patches is that the wearer's skin mayinterfere with their proper operations. For example, when an antenna isplaced in contact with the skin, the antenna's communication range issignificantly reduced. In one example, the wireless communication rangeof an antenna in contact with the skin is less than half the range ifthe antenna is placed just 4 mm away from the user's skin.

In addition, while some sensors such as electroencephalogram (EEG) andbody temperature sensors need to be in contact of users' skins toconduct measurements, other sensors such as ambient temperature sensorare required to measure signals away from the user's skin. The ambienttemperature if often different from the human body temperature that isin the range of 36-41° C.

There is therefore a need for more flexible wearable electronic patchesthat stick to skin longer, are comfortable for users to wear, and canperform intended functions at and away from users' skins so it is notaffected by body temperature.

SUMMARY OF THE INVENTION

The presently disclosure attempts to address the aforementionedlimitations in conventional electronic patches. The disclosed electronicpatches are highly compliant and more stretchable, while also being ableto support the circuit, chips, and other electronic components in thewearable electronic patches. The disclosed electronic patches can changetheir physical shape and dimension to relieve stresses such as repeatedelongations, therefore increasing durability. The disclosed electronicpatches can stay attached to skin for longer period of time enduringmuscle movements while providing constant contact to the skin.

The disclosed electronic patches are also breathable. The stretchabilityand the breathability make the disclosed electronic patches morecomfortable for the users.

Importantly, the disclosed electronic patches are capable wirelesscommunication with little interference from users' skins. Moreover, thedisclosed electronic patches can conduct measurements both at users'skins and away from the user's skin. The present application furtherdiscloses simple and effective manufacturing process to fabricate suchwearable electronic patches.

In one general aspect, the present invention relates to athree-dimensional electronic patch that includes a flat flexible circuitsubstrate comprising an elastic layer including a first portion and asecond portion, wherein the second portion includes at least sideconnected to the elastic layer and one or more sides defined by one ormore cuts in the elastic layer; a first sensor on the first portion ofthe elastic layer; a first conductive sensing pad under the firstportion of the elastic layer and in electrical connection with the firstsensor; and a conductive layer under the second portion of the elasticlayer and in electrical connection with the first sensor, wherein thesecond portion can be folded to position the conductive layer away fromthe first portion.

Implementations of the system may include one or more of the following.The first conductive sensing pad and the conductive layer of the foldedsecond portion can be respectively on opposing sides of thethree-dimensional electronic patch. The three-dimensional electronicpatch can further include a second sensor on the second portion of theelastic layer and in electrical connection with the conductive layer,wherein the conductive layer includes a second conductive sensing padelectrically connected with the second sensor. The second sensor canmeasure ambient temperature via the second conductive sensing pad. Thesecond conductive sensing pad and the second sensor can be electricallyconnected by a conductive pin through the second portion of the elasticlayer. The three-dimensional electronic patch can further include anadhesive layer configured to bond the second sensor to the first portionof the elastic layer. The first conductive sensing pad can be in contactwith a user's skin, wherein the first sensor is configured to measurebody temperature of a user via the first conductive sensing pad. Thefirst conductive sensing pad and the first sensor can be electricallyconnected by a conduct pin through the first portion of the elasticlayer. The conductive layer can include an antenna circuit. Thethree-dimensional electronic patch can further include a spacer on thesecond portion of the elastic layer, wherein the spacer is configured tokeep the conductive layer at a distance away from the conductive sensingpad while the second portion is folded to be in parallel to the firstportion. The three-dimensional electronic patch can further include anadhesive layer configured to bond the spacer to the first portion of theelastic layer. The antenna circuit can be electrically connected withthe first sensor by a circuit in or on the elastic layer. The antennacircuit can transmit wireless signals to transfer sensing data measuredby the first sensor.

In another general aspect, the present invention relates to athree-dimensional electronic patch that includes a flat flexible circuitsubstrate comprising: an elastic layer including a first portion and asecond portion, wherein the second portion includes at least sideconnected to the elastic layer and one or more sides defined by one ormore cuts in the elastic layer; a first sensor on the first portion ofthe elastic layer; a first conductive sensing pad under the firstportion of the elastic layer and in electrical connection with the firstsensor, wherein the first conductive sensing pad is configured to be incontact with a user's skin, wherein the first sensor is configured tomeasure body temperature of a user via the first conductive sensing pad;a second sensor on the second portion of the elastic layer; and a secondconductive sensing pad under the second portion of the elastic layer andin electrical connection with the second sensor, wherein the secondsensor is configured to measure ambient temperature via the secondconductive sensing pad, wherein the second portion is folded to positionthe second conductive sensing pad away from the first portion.

Implementations of the system may include one or more of the following.The first conductive sensing pad and the second conductive sensing padof the folded second portion can be respectively on opposing sides ofthe three-dimensional electronic patch. The first conductive sensing padand the first sensor can be electrically connected by a conduct pinthrough the elastic layer, wherein the second conductive sensing pad andthe second sensor are electrically connected by a conductive pin throughthe second portion of the elastic layer. The three-dimensionalelectronic patch can further include an adhesive layer configured tobond the second sensor to the first portion of the elastic layer.

In another general aspect, the present invention relates to athree-dimensional electronic patch that includes a flat flexible circuitsubstrate comprising: an elastic layer including a first portion and asecond portion, wherein the second portion includes at least sideconnected to the elastic layer and one or more sides defined by one ormore cuts in the elastic layer; a first sensor on the first portion ofthe elastic layer; a first conductive sensing pad under the firstportion of the elastic layer and in electrical connection with the firstsensor; and an antenna circuit under the second portion of the elasticlayer and in electrical connection with the first sensor, wherein thesecond portion is folded to position the antenna circuit away from thefirst portion.

Implementations of the system may include one or more of the following.The first conductive sensing pad and the antenna circuit of the foldedsecond portion are respectively on opposing sides of thethree-dimensional electronic patch. The three-dimensional electronicpatch can further include a spacer on the second portion of the elasticlayer, wherein the spacer is configured to keep the conductive layer ata distance away from the conductive sensing pad while the second portionis folded to be in parallel to the first portion. The three-dimensionalelectronic patch can further include an adhesive layer configured tobond the spacer to the first portion of the elastic layer. The antennacircuit is configured to transmit wireless signals to transfer sensingdata measured by the first sensor.

These and other aspects, their implementations and other features aredescribed in detail in the drawings, the description and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates the usage of a wearable electronic patch that isattached to a user's skin.

FIG. 2 illustrates two inter-connected electronic patches that arepositioned at different distances from a user's skin in accordance withsome embodiments of the present invention.

FIGS. 3A and 3B are respectively a cross-sectional and a top view of anexemplified flat flexible circuit substrate in preparation for athree-dimensional wearable electronic patch.

FIG. 4A is a cross-sectional view of a three-dimensional wearableelectronic patch prepared using the flat flexible circuit substrate inFIGS. 3A and 3B in accordance with some embodiments of the presentinvention.

FIG. 4B is a top view of the three-dimensional wearable electronic patchin FIG. 4A in accordance with some embodiments of the present invention.

FIGS. 5A and 5B are respectively a cross-sectional and a top view of anexemplified flat flexible circuit substrate including an antenna forwireless communications.

FIG. 6A is a cross-sectional view of a three-dimensional wearableelectronic patch prepared using the flat flexible circuit substrate inFIGS. 5A and 5B in accordance with some embodiments of the presentinvention.

FIG. 6B is a top view of the three-dimensional wearable electronic patchin FIG. 6A in accordance with some embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, an electronic patch 100 adheres to a user's skin110 for measuring body vital signs. The electronic patch 100 can beplaced on forehead, hand, wrist, arm, shoulder, waist, leg, foot, orother parts of the body. In the present application, the term“electronic patch” can also be referred to as “electronic sticker” or“electronic tag”.

As discussed above, wearable electronic patches face several challenges:the user's skin 110 may interfere with their proper operations. Forexample, the electronic patch 100 may include an antenna for wirelesscommunications with other devices. The antenna's communication range canbe significantly reduced when an antenna is placed in contact with theuser's skin 110. In one example, the wireless communication range of anantenna in contact with the skin is less than half the range if theantenna is placed just 4 mm away from the user's skin. In addition,while some sensors (e.g. for EEG and body temperature measurements) needto be in contact of users' skins 110 to conduct measurements, othersensors such as ambient temperature sensor are required to measuresignals away from the user's skin 110.

Furthermore, people's daily activities such as taking showers or bathes,swimming, exercises, holding weights, etc. involve muscle and skinmovements. The electronic patches thus need to responsively change theirphysical dimensions to be able to adhere to the skin for extendedperiods of time. The electronic patches may also be rubbed by clothing,hands, or other objects numerous times a day. While Band-Aid patchesusually cannot on skin for more than a week, conventional electronicpatches normally have much stiffer substrates, which makes them moreeasily rubbed off than Band-Aid stickers. Because drawbacks in thisareas, some conventional electronic patches are not comfortable to wearbecause they are not stretchable, inflexible, and not breathable.

In some embodiments, the presently disclosure aims to overcome thedrawbacks in conventional electronic patches, and to provide highlystretchable, compliant, durable, and comfortable wearable electronicpatches while performing intended sensing and communication functions atand away user's skins.

One solution to the above mentioned challenges is to provide functionsin two inter-connected electronic patches positioned at differentdistances from user's skin. Referring to FIG. 2, an electronic patchassembly 200 includes an electronic patch 210 that is attached to auser's skin 205 and a second electronic patch 210 that is positioned ata distance away from the user's skin 205. The electronic patch 210includes a substrate 220, a sensor 230 on the substrate 220, and asensing pad 240 under the substrate 220. The sensing pad 240 can be incontact with the user's skin 205 and is electrically connected to thesensor 230 by a conductive pin 235. The electronic patch 250 includes asubstrate 260, a sensor 270 under the substrate 260, and a sensing pad280 on the substrate 260 and facing away from the user's skin 205. Thesensing pad 280 is electrically connected to the sensor 270 by aconductive pin 275. The sensors 230 and 270 are electrically connectedby a conductive line 245. The substrates 220 and 260 can be made elasticmaterials.

In one application, the sensor 230 and the sensing pad 240 can measurebody temperature of the user, while the sensor 270 and the sensing pad280 can measure ambient temperature. An insulating pad or spacer (notshown) can be disposed between the user's skin 205 and the sensor 270 toinsulate ambient temperature measurement from the user's body heat.While the electronic patch assembly 200 can perform some intendedfunctions, it requires two inter-connected electronic patches. Theconductive line between the two electronic patches can easily be brokenduring user's body movements.

In some embodiments, the presently disclosure also provide simplestructure and convenient manufacturing process for stretchable,compliant, durable, and comfortable wearable electronic patches that canperform intended sensing, actuation, and communication functions at andaway user's skins.

Referring to FIGS. 3A and 3B, a flat flexible circuit substrate 300includes an elastic layer 305 that includes a first portion 310 and asecond portion 350. A sensor 320 is mounted on the first portion 310 ofthe elastic layer 305, while a sensing pad 330 is bonded under the firstportion 310 of the elastic layer 305. The sensing pad 330 iselectrically connected to the sensor 320 by a conductive pin 335 throughthe elastic layer 305.

The second portion 350 of the elastic layer 305 is defined by cut(s) 380along two or more sides and is connected to the first portion 310 on atleast one side 385. The cut(s) 380, as described below, allow the secondportion 350 to be partially lifted off the elastic layer 305 and flipover the first portion 310 of the elastic layer 305.

A sensor 360 is mounted on the second portion 350 of the elastic layer305, while a sensing pad 370 is bonded under the second portion 350 ofthe elastic layer 305. The sensing pad 370 is electrically connected tothe sensor 360 by a conductive pin 375 through the elastic layer 305.The sensors 320 and 360 are electrically connected by an electriccircuit (not shown) embedded or on the elastic layer 305.

The elastic layer 305 is made of a non-conductive material such as anelastomeric material or a viscoelastic polymeric material. The elasticlayer 205 can be made of a material having low Young's modulus and highfailure strain. In some embodiments, the elastic layer 305 has a Young'sModulus<0.3 Gpa. In some cases, the elastic layer 305 and can haveYoung's Modulus<0.1 Gpa to provide enhanced flexibility and tackability.Materials suitable for the elastic layer 305 include elastomers,viscoelastic polymers, such as silicone, and medical grade polyurethanethat is a transparent medical dressing used to cover and protect woundswith breathability and conformation to skin. On the other hand, thesensors 320 and 360 and the sensing pads 330, 370 are usually made morerigid materials. In some embodiments, the sensors 320 and 360 and thesensing pads 330, 370 can have Young's Modulus larger than 0.5 Gpa, suchas in a range between 1.0 Gpa-10 Gpa.

The flat flexible circuit substrate 300 is used to as an intermediatepreparatory structure for making a three-dimensional electronic patch400, as shown in FIGS. 4A and 4B. The second portion 350 of the elasticlayer 305 is lifted up by opening the cut(s) 380, and flipped such thatthe sensor 360 is positioned on or above the first portion 310 of theelastic layer 305. An adhesive can be applied on the sensor 360 to allowit to adhere to the first portion 310 of the elastic layer 305. Thesensing pad 370 is now on the second portion 350 and facing away fromthe first portion 310. The sensing pad 370 can be in parallel to thefirst portion 310. The side 385 stays connected to the rest of theelastic layer 305. The lifting and flipping of the second portion 350leaves a void 390 in the elastic layer 305.

The three-dimensional electronic patch 400 can be used to sense signalsat and away from a user's skin. In one application, the sensing pad 330and the lower surface of the first portion 310 of the elastic layer 305are in contact of a user's skin. An adhesive layer can be applied underthe elastic layer 305 to help stick to the user's skin. The adhesivelayer can be pressure sensitive, which allows the compliant wearablepatches tightly adhere to human skin under pressure, applied for exampleby a thumb. For instance, the adhesive layer can be made of a medicalpressure sensitive adhesive. An example of such adhesive is medicalgrade tackified Hypoallergenic Pressure Sensitive Adhesive. The sensor320 and the sensing pad 330 can measure body temperature. The sensor 360and the sensing pad 370 can measure ambient temperature. Since thesensing pad 370 is spaced apart from the user's skin, the ambienttemperature sensing is not or little affected by the heat from theuser's body.

In some embodiments, the skin temperature measure measured by the sensor330 can be calibrated and corrected by the ambient temperature measuredby the sensor 360 because skin temperature often varies in response toambient temperature. The difference between the two temperaturesmeasured by the sensors 330 and 360 can be used to extrapolate the truetemperature within the core of the user's body.

In some embodiments, referring to FIGS. 5A and 5B, a flat flexiblecircuit substrate 500 includes an elastic layer 505 that includes afirst portion 510 and a second portion 550. A sensor 520 is mounted onthe first portion 510 of the elastic layer 505, while a sensing pad 530is bonded under the first portion 510 of the elastic layer 505. Thesensing pad 530 is electrically connected to the sensor 520 by aconductive pin 535 through the elastic layer 505.

The second portion 550 of the elastic layer 505 is defined by cut(s) 580along two or more sides and is connected to the first portion 510 on atleast one side 585. The cut(s) 580, as described below, allows thesecond portion 550 to be lifted up and flip over the first portion 510of the elastic layer 505.

A spacer 560 is mounted on the second portion 550 of the elastic layer505. A conductive circuit such as an antenna circuit 570 is bonded underor embedded within the second portion 550 of the elastic layer 505. Theantenna circuit 570 can include conductive line disposed in severalwounds (e.g. in a helical shape). The antenna circuit 570 and the sensor520 are electrically connected by an electric circuit (not shown)embedded or on the elastic layer 505.

The elastic layer 505 is made of a non-conductive material such as anelastomeric material or a viscoelastic polymeric material. The elasticlayer 205 can be made of a material having low Young's modulus and highfailure strain. In some embodiments, the elastic layer 505 has Young'sModulus<0.3 Gpa. In some cases, the elastic layer 505 and can haveYoung's Modulus<0.1 Gpa to provide enhanced flexibility and tackability.Materials suitable for the elastic layer 505 include elastomers,viscoelastic polymers, such as silicone, and medical grade polyurethanethat is a transparent medical dressing used to cover and protect woundswith breathability and conformation to skin. On the other hand, thesensors 520, the sensing pad 530, and the antenna circuit 570 areusually made more rigid materials. In some embodiments, the sensors 520,the sensing pad 530, and the antenna circuit 570 can have Young'sModulus larger than 0.5 Gpa, such as in a range between 1.0 Gpa-10 Gpa.

The flat flexible circuit substrate 500 is used to as an intermediatepreparatory structure for making a three-dimensional electronic patch600, as shown in FIGS. 6A and 6B. The second portion 550 of the elasticlayer 505 is lifted up by opening the cut(s) 580, and flipped such thatthe spacer 560 is positioned on or above the first portion 510 of theelastic layer 505. The side 585 stays connected to the rest of theelastic layer 505. The lifting and flipping of the second portion 550leaves a void 590 in the elastic layer 505.

An adhesive can be applied on the sensor 560 to allow it to adhere tothe first portion 510 of the elastic layer 505. The antenna circuit 570is now on the second portion 550 and facing away from the first portion510, thus minimizing interference from the user's skin as well as fromother components in the three-dimensional electronic patch 600. Theantenna circuit 570 can substantially parallel to the first portion 510or to the user's skin.

The three-dimensional electronic patch 600 can be used to sense signalsat a user's skin while transmitting wireless signals from an antennaaway from the user's skin. The sensing pad 530 and the lower surface ofthe first portion 510 of the elastic layer 505 are in contact of auser's skin. An adhesive layer can be applied under the elastic layer505 to help stick to the user's skin. The adhesive layer can be pressuresensitive, which allows the compliant wearable patches tightly adhere tohuman skin under pressure, applied for example by a thumb. For instance,the adhesive layer can be made of a medical pressure sensitive adhesive.An example of such adhesive is medical grade tackified HypoallergenicPressure Sensitive Adhesive.

For example, the sensor 520 and the sensing pad 530 can measure bodytemperature, EEG signals, pulse signal, and other body vital signals.The antenna circuit 570 can transmit wireless signals to other devices.The thickness of the spacer 560 can be adjusted to minimize theinterference of user's body to wireless transmissions. As discussedabove, the radial range of wireless communication of thethree-dimensional electronic patch 600 can double by keeping the antennacircuit 570 at 4 mm away from the user's skin in comparison to aconventional electronic patch in which the antenna circuit 570 beingpositioned near the user's skin.

The antenna circuit 570, along with other components (such as anamplifier, a transceiver, a processor etc.) can communicate withexternal devices based on NFC standard, RFID, Wi-Fi, Bluetooth, or othertypes of wireless communication standard. Examples of external devicesinclude smart phones, computers, mobile payment devices, scanners andreaders (e.g. RFID readers), medical devices, security systems, personalidentification systems, etc. Wireless communications compatible with theelectronic patch 200 include NFC in a frequency range near 13.56 MHz,UHF RFID at about 915 MHz, Bluetooth in 2.4 GHz or 5 GHz frequencyranges, and so on.

For example, the antenna circuit 570 can transmit wireless signals totransfer sensing data measured by the sensor 520 to other devices, aswell as receive commands from other devices.

The three-dimensional electronic patches 400, 600 can also includeelectronic components such as the semiconductor chips, resistors,capacitors, inductors, diodes (including for example photo sensitive andlight emitting types), sensors, transistors, amplifiers. The sensors canalso measure temperature, acceleration and movements, and chemical orbiological substances. The electronic components can also includeelectromechanical actuators, chemical injectors, etc. The semiconductorchips can perform communications, logic, signal or data processing,control, calibration, status report, diagnostics, and other functions.

The presently disclosed three-dimensional wearable electronic patchescan provide sensing and communication functions away from the users'skins in addition to sensing and other functions in contact from users'skins. An advantage of the presently disclosed three-dimensionalwearable electronic patch is that they can be easily manufactured fromflat flexible circuit substrates instead of having to assemble multipleelectronic patches. In one implementation, the disclosedthree-dimensional wearable electronic patches can be packaged andshipped in flat configurations; the second portion can be partiallylifted off and folded in the field to prepare the three dimensionalstructure.

The presently disclosed three-dimensional wearable electronic patchesare flexible and stretchable thus providing durability and more comfortto the users.

While this document contains many specifics, these should not beconstrued as limitations on the scope of an invention that is claimed orof what may be claimed, but rather as descriptions of features specificto particular embodiments. Certain features that are described in thisdocument in the context of separate embodiments can also be implementedin combination in a single embodiment. Conversely, various features thatare described in the context of a single embodiment can also beimplemented in multiple embodiments separately or in any suitablesub-combination. Moreover, although features may be described above asacting in certain combinations and even initially claimed as such, oneor more features from a claimed combination can in some cases be excisedfrom the combination, and the claimed combination may be directed to asub-combination or a variation of a sub-combination.

Only a few examples and implementations are described. Otherimplementations, variations, modifications and enhancements to thedescribed examples and implementations may be made without deviatingfrom the spirit of the present invention. For example, the applicationsand the types of electronic components of the disclosed electronicpatches are not limited by the examples given above; they can includeother functions such as other types of sensing (pressure, vibration,acceleration, electrical, magnetic, optical, etc.), communications,fluid delivery, heat production, mechanical actuations, and so on. Othervital body signals can be measured in addition to the examples givenabove.

The foldable portion of the elastic layer can have other shapes andconfigurations without deviating from the present invention. Thesensors, antenna, and spacers associated with the foldable portion ofthe elastic layer can be disposed at different positions relative to thefoldable portion of the elastic layer as well as relative to othercomponents in un-folded portions of the elastic layer.

What is claimed is:
 1. A three-dimensional electronic patch, comprising:a flat flexible circuit substrate, comprising: an elastic layerincluding a first portion and a second portion, wherein the secondportion includes at least one side connected to the first portion of theelastic layer and one or more sides defined by one or more cuts in theelastic layer; a first sensor on the first portion of the elastic layer;a first conductive sensing pad under the first portion of the elasticlayer and in electrical connection with the first sensor; and aconductive layer under the second portion of the elastic layer and inelectrical connection with the first sensor, wherein the second portionis folded to position the conductive layer away from the first portion.2. The three-dimensional electronic patch of claim 1, wherein the firstconductive sensing pad and the conductive layer of the folded secondportion are respectively on opposing sides of the three-dimensionalelectronic patch.
 3. The three-dimensional electronic patch of claim 1,further comprising: a second sensor on the second portion of the elasticlayer and in electrical connection with the conductive layer, whereinthe conductive layer includes a second conductive sensing padelectrically connected with the second sensor.
 4. The three-dimensionalelectronic patch of claim 3, wherein the second sensor is configured tomeasure ambient temperature via the second conductive sensing pad. 5.The three-dimensional electronic patch of claim 3, wherein the secondconductive sensing pad and the second sensor are electrically connectedby a conductive pin through the second portion of the elastic layer. 6.The three-dimensional electronic patch of claim 3, further comprising:an adhesive layer configured to bond the second sensor to the firstportion of the elastic layer.
 7. The three-dimensional electronic patchof claim 1, wherein the first conductive sensing pad is configured to bein contact with a user's skin, wherein the first sensor is configured tomeasure body temperature of a user via the first conductive sensing pad.8. The three-dimensional electronic patch of claim 1, wherein the firstconductive sensing pad and the first sensor are electrically connectedby a conduct pin through the first portion of the elastic layer.
 9. Thethree-dimensional electronic patch of claim 1, wherein the conductivelayer comprises an antenna circuit.
 10. The three-dimensional electronicpatch of claim 9, further comprising: a spacer on the second portion ofthe elastic layer, wherein the spacer is configured to keep theconductive layer at a distance away from the conductive sensing padwhile the second portion is folded to be in parallel to the firstportion.
 11. The three-dimensional electronic patch of claim 10, furthercomprising: an adhesive layer configured to bond the spacer to the firstportion of the elastic layer.
 12. The three-dimensional electronic patchof claim 9, wherein the antenna circuit is electrically connected withthe first sensor by a circuit in or on the elastic layer.
 13. Thethree-dimensional electronic patch of claim 9, wherein the antennacircuit is configured to transmit wireless signals to transfer sensingdata measured by the first sensor.
 14. A three-dimensional electronicpatch, comprising: a flat flexible circuit substrate, comprising: anelastic layer including a first portion and a second portion, whereinthe second portion includes at least one side connected to the firstportion of the elastic layer and one or more sides defined by one ormore cuts in the elastic layer; a first sensor on the first portion ofthe elastic layer; a first conductive sensing pad under the firstportion of the elastic layer and in electrical connection with the firstsensor, wherein the first conductive sensing pad is configured to be incontact with a user's skin, wherein the first sensor is configured tomeasure body temperature of a user via the first conductive sensing pad;a second sensor on the second portion of the elastic layer; and a secondconductive sensing pad under the second portion of the elastic layer andin electrical connection with the second sensor, wherein the secondsensor is configured to measure ambient temperature via the secondconductive sensing pad, wherein the second portion is folded to positionthe second conductive sensing pad away from the first portion.
 15. Thethree-dimensional electronic patch of claim 14, wherein the firstconductive sensing pad and the second conductive sensing pad of thefolded second portion are respectively on opposing sides of thethree-dimensional electronic patch.
 16. The three-dimensional electronicpatch of claim 14, wherein the first conductive sensing pad and thefirst sensor are electrically connected by a conduct pin through theelastic layer, wherein the second conductive sensing pad and the secondsensor are electrically connected by a conductive pin through the secondportion of the elastic layer.
 17. The three-dimensional electronic patchof claim 14, further comprising: an adhesive layer configured to bondthe second sensor to the first portion of the elastic layer.
 18. Athree-dimensional electronic patch, comprising: a flat flexible circuitsubstrate, comprising: an elastic layer including a first portion and asecond portion, wherein the second portion includes at least one sideconnected to the first portion of the elastic layer and one or moresides defined by one or more cuts in the elastic layer; a first sensoron the first portion of the elastic layer; a first conductive sensingpad under the first portion of the elastic layer and in electricalconnection with the first sensor; and an antenna circuit under thesecond portion of the elastic layer and in electrical connection withthe first sensor, wherein the second portion is folded to position theantenna circuit away from the first portion.
 19. The three-dimensionalelectronic patch of claim 18, wherein the first conductive sensing padand the antenna circuit of the folded second portion are respectively onopposing sides of the three-dimensional electronic patch.
 20. Thethree-dimensional electronic patch of claim 18, further comprising: aspacer on the second portion of the elastic layer, wherein the spacer isconfigured to keep the conductive layer at a distance away from theconductive sensing pad while the second portion is folded to be inparallel to the first portion.
 21. The three-dimensional electronicpatch of claim 18, further comprising: an adhesive layer configured tobond the spacer to the first portion of the elastic layer.
 22. Thethree-dimensional electronic patch of claim 18, wherein the antennacircuit is configured to transmit wireless signals to transfer sensingdata measured by the first sensor.